Used Nagase Integrex NSF-600 Wafer Grinding Machine Japan

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Product Highlight

Used Nagase Integrex NSF-600 ultra precision wafer grinding machine is a high-accuracy CNC grinding system originally manufactured in Japan for advanced semiconductor and precision component processing. This machine is designed for ultra-thin wafer grinding, optical surface finishing, ceramic machining, and hard brittle material processing.

With FANUC CNC control, hydrostatic precision grinding technology, and in-process measurement capability, the NSF-600 supports micron-level surface accuracy requirements. The machine features a 600mm grinding wheel system, 0.001mm minimum feed resolution, and ultra-low operating hours, making it suitable for semiconductor manufacturers, research facilities, and precision machining companies looking for a cost-effective alternative to new equipment.

Product Description

Used Nagase Integrex NSF-600 ultra precision wafer grinding machine, imported from Japan. Equipped with FANUC CNC control, low operation hours, and capable of 0.1μm-level precision grinding with in-process measurement for semiconductor wafers, ceramics, glass, and hard materials.

Technical Specifications

Item	Specification
Machine Type	Used Ultra Precision Wafer Grinding Machine
Brand	Nagase Integrex
Model	NSF-600
Origin	Japan
CNC System	FANUC CNC Control
Grinding Method	Precision Surface Grinding / Wafer Grinding
Grinding Wheel Diameter	Ø600 mm
Grinding Wheel Width	30 mm
Grinding Wheel Speed	0 - 600 min⁻¹
X Axis Travel	100 mm
Z Axis Travel	150 mm
Vertical Feed Stroke	150 mm
Oscillation Stroke	100 mm
Minimum Feed Resolution	0.001 mm
Machine Accuracy	Ultra Precision Level
Power-On Time	Approx. 2,882 hours
Operating Time	Approx. 967 hours
Machine Size	Approx. 3100 × 2500 × 2500 mm
Control System	FANUC
Processing Capability	0.1μm-level precision grinding with in-process measurement

Application Industries & Processing Fields

Semiconductor Manufacturing

Used for:

Silicon wafer thinning
Wafer surface finishing
Semiconductor substrate processing
Precision optical wafer preparation

Electronics Industry

Suitable for:

Ceramic electronic components
Glass substrates
Precision components for electronic devices

Optics Industry

Applicable for:

Optical glass processing
High flatness surface grinding
Precision optical components

Advanced Materials Research

Suitable for laboratories and manufacturers working with:

Hard brittle materials
Ultra-thin precision parts
Prototype semiconductor components

FAQ

What materials can this NSF-600 process?

The machine is mainly used for semiconductor wafers, silicon, ceramics, glass, quartz, and other hard brittle materials requiring high precision surface finishing.