Used Nagase NSF-600 Ultra Precision Wafer Thinning Grinder Made in Japan
Product Description
This Nagase Integrex NSF-600 is an original Japanese ultra-precision wafer thinning and grinding machine. It is designed for high-accuracy thinning of semiconductor wafers, ceramic substrates, glass chips, sapphire, hard alloy and other hard-to-grind materials.
With 0.1μm-level thinning capability, online inspection and FANUC control system, this machine is suitable for R&D, process testing, precision component manufacturing and small-batch high-precision production.
0.1μm-Level Ultra Precision Thinning
The NSF-600 supports ultra-fine wafer thinning and precision surface grinding, helping users achieve stable thickness control and excellent surface quality.
Original Japanese Nagase Machine
Made in Japan by Nagase Integrex, a well-known manufacturer of ultra-precision grinding equipment for advanced material processing.
Suitable for Hard-to-Grind Materials
Ideal for processing semiconductor wafers, ceramics, glass, sapphire, hard alloy and other brittle or high-hardness materials.
FANUC Control System
Equipped with a reliable FANUC control system, providing stable operation, precise motion control and convenient machine management.
Online Inspection Function
The machine supports online inspection, which helps improve machining accuracy and reduce manual measurement errors during wafer thinning.
Low Operating Hours
The machine is a 2016 model with low working hours, making it a valuable choice for buyers who need Japanese precision equipment at a more cost-effective price.
Technical Specifications
| Item | Specification |
|---|---|
| Brand | Nagase Integrex |
| Model | NSF-600 |
| Origin | Japan |
| Year | 2016 |
| Control System | FANUC |
| Power-on Time | Approx. 2882 hours |
| Operating Time | Approx. 967 hours |
| X-axis Stroke | Approx. 100 mm |
| Z-axis Stroke | Approx. 150 mm |
| Grinding Wheel Size | φ600 mm × 30 mm |
| Work Spindle Speed | 70–600 min⁻¹ |
| Grinding Wheel Speed | 0–600 min⁻¹ |
| Vertical Axis Stroke | 150 mm |
| Oscillation Axis Stroke | 100 mm |
| Swing Axis Stroke | 100 mm |
| Minimum Feed Unit | 0.0001 mm |
| Machine Size | Approx. 3100 × 2500 × 2500 mm |
| Suitable Materials | Semiconductor wafers, ceramic substrates, glass wafers, sapphire, hard alloy, precision parts |
Specifications are for reference only. Final data should be confirmed according to the actual machine condition.
Application Industries
This Nagase NSF-600 ultra precision grinder is suitable for:
Semiconductor wafer thinning
Ceramic substrate grinding
Glass wafer and glass chip processing
Sapphire wafer processing
Hard alloy precision grinding
Optical material processing
R&D laboratory testing
High-precision small component manufacturing
FAQ
What materials can this machine process?
It can process semiconductor wafers, ceramic substrates, glass wafers, sapphire, hard alloy and other hard or brittle materials.
Is this machine suitable for semiconductor wafer thinning?
Yes. The Nagase NSF-600 is suitable for high-precision wafer thinning and precision surface grinding applications.
hat is the control system?
The machine is equipped with a FANUC control system.
Is this a new machine?
No. This is a used original Japanese machine, manufactured in 2016.
What is the main advantage of this machine?
Its main advantage is ultra-precision thinning capability, stable Japanese machine structure, online inspection and suitability for hard-to-grind wafer materials.
$428352.00
Brand
Nagase
Model
NSF-600
Origin
JP
Processing Time
3526h
Machine Status
- In stock
- Company-owned inventory
- Delivery time: 7 days
Available inspection support
- Machine appearance check
- Control system power-on check
- Spindle and axis movement check
- Grinding area photo check
- Electrical cabinet photo check
- Machine nameplate verification
- Remote video inspection
- Optional third-party inspection
Supplier's customization ability
- Minor customization
- Drawing-based customization
- Sample-based customization
- Full customization